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DIFF Subgroup
G06K 13/103

using mechanical means

Introduced: July 1974

Full Title

Full titles differ between systems:

IPC:

Conveying record carriers from one station to another, e.g. from stack to punching mechanism > the record carrier having longitudinal dimension comparable with transverse dimension, e.g. punched card > Feeding or discharging cards > from magazine to conveying arrangement > using mechanical means

CPC:

Conveying record carriers from one station to another, e.g. from stack to punching mechanism (conveying record carriers combined with another operation, e.g. with reading G06K17/00) > the record carrier having longitudinal dimension comparable with transverse dimension, e.g. punched card > Feeding or discharging cards > from magazine to conveying arrangement > using mechanical means

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class G06,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 66,669
  2. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,313
  3. MICROSOFT TECHNOLOGY LICENSING US 41,918
  4. GOOGLE US 32,969
  5. SGCC(STATE GRID CORPORATION OF CHINA) 30,822
  6. INTEL CORPORATION US 30,010
  7. TENCENT TECHNOLOGY (SHENZHEN) COMPANY 28,235
  8. HUAWEI TECHNOLOGIES COMPANY CN 26,079
  9. APPLE US 21,891
  10. HUAWEI TECHNOLOGIES COMPANY 20,505

Top Applicants (CPC)

Class G06,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 76,952
  2. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,841
  3. MICROSOFT TECHNOLOGY LICENSING US 44,778
  4. GOOGLE US 35,735
  5. INTEL CORPORATION US 32,087
  6. HUAWEI TECHNOLOGIES COMPANY CN 30,572
  7. TENCENT TECHNOLOGY (SHENZHEN) COMPANY 25,023
  8. APPLE US 23,482
  9. SGCC(STATE GRID CORPORATION OF CHINA) 22,548
  10. HUAWEI TECHNOLOGIES COMPANY 20,917