DIFF Subgroup
G10B 3/08 Pipes, e.g. open pipes, reed pipes
Introduced: September 1968
Title
Titles differ between systems:
IPC: Pipes, e.g. open pipes or reed pipes
CPC: Pipes, e.g. open pipes, reed pipes
Full Title
Full titles differ between systems:
IPC:
Details or accessories > Pipes, e.g. open pipes or reed pipes
CPC:
Details or accessories > Pipes, e.g. open pipes, reed pipes
No child classifications to compare. This is a leaf node in both IPC and CPC.
Top Applicants
Top Applicants (IPC)
Class G10,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 5,218
- GOOGLE US 4,644
- FRAUNHOFER DE 4,601
- SONY CORPORATION JP 2,380
- HUAWEI TECHNOLOGIES COMPANY CN 2,179
- YAMAHA CORPORATION 2,120
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 1,974
- MICROSOFT TECHNOLOGY LICENSING US 1,916
- AMAZON TECHNOLOGIES US 1,866
- DOLBY LABORATORIES LICENSING CORPORATION US 1,843
Top Applicants (CPC)
Class G10,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 6,277
- GOOGLE US 5,429
- FRAUNHOFER DE 4,984
- SONY CORPORATION JP 2,808
- HUAWEI TECHNOLOGIES COMPANY CN 2,577
- MICROSOFT TECHNOLOGY LICENSING US 2,382
- DOLBY LABORATORIES LICENSING CORPORATION US 2,123
- QUALCOMM US 2,117
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,049
- AMAZON TECHNOLOGIES US 1,924