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DIFF Subgroup
G11C 11/4078

Safety or protection circuits, e.g. for preventing inadvertent or unauthorised reading or writing; Status cells; Test cells (protection of memory contents during checking or testing G11C29/52)

Introduced: January 2000

Title

Titles differ between systems:

IPC: Safety or protection circuits, e.g. for preventing inadvertent or unauthorised reading or writing; Status cells; Test cells

CPC: Safety or protection circuits, e.g. for preventing inadvertent or unauthorised reading or writing; Status cells; Test cells (protection of memory contents during checking or testing G11C29/52)

Full Title

Full titles differ between systems:

IPC:

Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor > using electric elements > using semiconductor devices > using transistors > forming cells needing refreshing or charge regeneration, i.e. dynamic cells > Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing > for memory cells of the field-effect type > Safety or protection circuits, e.g. for preventing inadvertent or unauthorised reading or writing; Status cells; Test cells

CPC:

Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor (G11C14/00 - G11C21/00 take precedence) > using electric elements > using semiconductor devices > using transistors > forming cells needing refreshing or charge regeneration, i.e. dynamic cells > Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing > for memory cells of the field-effect type > Safety or protection circuits, e.g. for preventing inadvertent or unauthorised reading or writing; Status cells; Test cells (protection of memory contents during checking or testing G11C29/52)

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 10,574
  2. SK HYNIX KR 9,138
  3. SAMSUNG ELECTRONICS COMPANY KR 9,004
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
  5. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
  6. INTEL CORPORATION US 2,952
  7. SANDISK TECHNOLOGIES US 2,905
  8. WESTERN DIGITAL TECHNOLOGIES US 2,630
  9. TOSHIBA CORPORATION JP 2,593
  10. SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 12,397
  2. SAMSUNG ELECTRONICS COMPANY KR 12,238
  3. SK HYNIX KR 11,371
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
  5. INTEL CORPORATION US 3,874
  6. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
  7. SANDISK TECHNOLOGIES US 3,151
  8. SK HYNIX 3,143
  9. SAMSUNG ELECTRONICS COMPANY 3,073
  10. WESTERN DIGITAL TECHNOLOGIES US 2,961