H01C 17/02 adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52)
Introduced: July 1974
Title
Titles differ between systems:
IPC: adapted for manufacturing resistors with envelope or housing
CPC: adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52)
Full Title
Full titles differ between systems:
Apparatus or processes specially adapted for manufacturing resistors > adapted for manufacturing resistors with envelope or housing
Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04) > adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52)
No child classifications to compare. This is a leaf node in both IPC and CPC.