H01C RESISTORS
Introduced: September 1968
Description
Resistors and resistive elements used in electrical circuits and electronic devices. This subclass covers fixed and variable resistors, thermistors, varistors, and resistive films or coatings, including their construction, materials (such as carbon, wire-wound, or metal film), and manufacturing processes. Related technologies include resistor networks, resistor arrays, and hybrid resistive assemblies integrated with other components. Adjacent classes cover resistor applications within specific circuit configurations (H01L for semiconductors) and resistive heating elements designed primarily for thermal rather than electrical control purposes.
Additional Content IPC
Glossary
adjustable mechanically adjustable
Limiting references
Apparatus or processes for filling or compressing insulating material in heating element tubes Resistors having potential barriers, e.g. field-effect resistors , Photoresistors and similar semiconductor devices in which radiation controls flow of current through the device Magnetic-field-controlled resistors and similar devices using galvano-magnetic or similar magnetic effects , Bulk negative resistance effect devices
Application references
Impedance networks
IPC and CPC are identically structured here. All 8 subcodes exist in both systems.
3 shared codes have differing titles between IPC and CPC.
Child Classifications
Navigate with arrow keys, Enter to open
- H01C 17/00 Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04) +2 CPC IPC+CPC Available in IPC and CPC
- H01C 3/00 Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids +1 CPC IPC+CPC Available in IPC and CPC
- H01C 7/00 Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material (consisting of loose powdered or granular material H01C8/00; resistors having potential barriers, e.g. field-effect resistors, H10D1/40 - H10D1/43, H10K10/10; semiconductor devices sensitive to electromagnetic or corpuscular radiation, e.g. photoresistors, H10F30/00; magnetic field controlled resistors H10N50/10; bulk negative resistance effect devices H10N80/00) +4 CPC IPC+CPC Available in IPC and CPC
- H01C 8/00 Non-adjustable resistors consisting of loose powdered or granular conducting, or powdered or granular semi-conducting material since 1974 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080