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DIFF Subgroup
H01F 41/06

Coil winding

Introduced: September 1968

Full Title

Full titles differ between systems:

IPC:

Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties > for manufacturing cores, coils or magnets > for manufacturing coils > Coil winding

CPC:

Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties > for manufacturing cores, coils, or magnets (H01F41/14 takes precedence; for dynamo-electric machines H02K15/00) > for manufacturing coils > Coil winding

Additional Content IPC

Former Frame, e.g. composed of electrically insulating material, around which a coil is wound. Examples of former are bobbins, spools or winding supports

IPC and CPC are identically structured here. All 12 subcodes exist in both systems.

1 shared codes have differing titles between IPC and CPC.

Child Classifications

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  • H01F 41/076 Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire since 2016 IPC+CPC Available in IPC and CPC
  • H01F 41/077 Deforming the cross section or shape of the winding material while winding since 2016 IPC+CPC Available in IPC and CPC
  • H01F 41/079 Measuring electrical characteristics while winding since 2016 IPC+CPC Available in IPC and CPC
  • H01F 41/08 Winding conductors onto closed formers or cores, e.g. threading conductors through toroidal cores IPC+CPC Available in IPC and CPC
  • H01F 41/094 Tensioning or braking devices since 2016 IPC+CPC Available in IPC and CPC
  • H01F 41/096 Dispensing or feeding devices since 2016 IPC+CPC Available in IPC and CPC
  • H01F 41/098 Mandrels; Formers since 2016 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080