DIFF Subgroup
H01F 41/14 for applying magnetic films to substrates
Introduced: September 1968
Full Title
Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties > for applying magnetic films to substrates
IPC and CPC are identically structured here. All 6 subcodes exist in both systems.
1 shared codes have differing titles between IPC and CPC.
IPC defines codes here since 1980.
Child Classifications
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- H01F 41/16 the magnetic material being applied in the form of particles, e.g. by serigraphy (H01F41/18 take precedence) since 1980 IPC+CPC Available in IPC and CPC
- H01F 41/22 Heat treatment; Thermal decomposition; Chemical vapour deposition since 1980 IPC+CPC Available in IPC and CPC
- H01F 41/30 for applying nanostructures, e.g. by molecular beam epitaxy [MBE] since 2000 +2 CPC IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080