DIFF Subgroup
H01G 2/02 Mountings
Introduced: January 1995
Full Title
Full titles differ between systems:
IPC:
Details of capacitors not covered by a single one of groups > Mountings
CPC:
Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00 > Mountings
IPC and CPC are identically structured here. All 2 subcodes exist in both systems.
IPC defines codes here since 1995.
Child Classifications
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- H01G 2/06 specially adapted for mounting on a printed-circuit support since 1995 +1 CPC IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080