Driving mechanisms, i.e. for transmitting driving force to the contacts (snap-action arrangements H01H5/00; introducing a predetermined time delay H01H7/00)

Introduced: September 1968

Title

Titles differ between systems:

IPC: Driving mechanisms, i.e. for transmitting driving force to the contacts

CPC: Driving mechanisms, i.e. for transmitting driving force to the contacts (snap-action arrangements H01H5/00; introducing a predetermined time delay H01H7/00)

Full Title

Full titles differ between systems:

IPC:

Mechanisms for operating contacts > Driving mechanisms, i.e. for transmitting driving force to the contacts

CPC:

Mechanisms for operating contacts ( thermal actuating or release means H01H37/02) > Driving mechanisms, i.e. for transmitting driving force to the contacts (snap-action arrangements H01H5/00; introducing a predetermined time delay H01H7/00)

Of 12 combined children, 10 exist in both systems.

2 codes are CPC-only extensions.

Note: 2 CPC extensions are marked as secondary classification only.

Child Classifications

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H01H 2003/323 2nd only CPC only CPC only
H01H 2003/326 2nd only CPC only CPC only
H01H 3/34 using ratchet IPC+CPC Available in IPC and CPC
H01H 3/36 using belt, chain, or cord IPC+CPC Available in IPC and CPC
H01H 3/38 using spring or other flexible shaft coupling IPC+CPC Available in IPC and CPC
H01H 3/40 using friction, toothed, or screw-and-nut gearing +1 CPC IPC+CPC Available in IPC and CPC
H01H 3/42 using cam or eccentric IPC+CPC Available in IPC and CPC
H01H 3/44 using Geneva movement IPC+CPC Available in IPC and CPC
H01H 3/46 using rod or lever linkage, e.g. toggle +2 CPC IPC+CPC Available in IPC and CPC
H01H 3/48 using lost-motion device IPC+CPC Available in IPC and CPC
H01H 3/50 with indexing or locating means, e.g. indexing by ball and spring +2 CPC IPC+CPC Available in IPC and CPC
H01H 3/52 with means to ensure stopping at intermediate operative positions IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
SAMSUNG ELECTRONICS COMPANY KR 42,206
LG CHEM KR 21,383
APPLIED MATERIALS US 20,441
LG ENERGY SOLUTION KR 20,279
SAMSUNG DISPLAY KR 19,725
CHINESE ACADEMY OF SCIENCES 19,400
TOYOTA MOTOR CORPORATION 18,819
SGCC(STATE GRID CORPORATION OF CHINA) 18,082
TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 37,897
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
APPLIED MATERIALS US 21,640
LG ENERGY SOLUTION KR 20,770
LG CHEM KR 19,835
TOKYO ELECTRON JP 18,519
ROBERT BOSCH DE 14,595
INTEL CORPORATION US 13,580
MURATA MANUFACTURING COMPANY JP 12,151
SAMSUNG SDI COMPANY KR 12,080