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DIFF Subgroup
H01H 47/04

for holding armature in attracted position, e.g. when initial energising circuit is interrupted; for maintaining armature in attracted position, e.g. with reduced energising current

Introduced: September 1968

Title

Titles differ between systems:

IPC: for holding armature in attracted position, e.g. when initial energising circuit is interrupted or with reduced energising current

CPC: for holding armature in attracted position, e.g. when initial energising circuit is interrupted; for maintaining armature in attracted position, e.g. with reduced energising current

Full Title

Full titles differ between systems:

IPC:

Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current > for modifying the operation of the relay > for holding armature in attracted position, e.g. when initial energising circuit is interrupted or with reduced energising current

CPC:

Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current > for modifying the operation of the relay > for holding armature in attracted position, e.g. when initial energising circuit is interrupted; for maintaining armature in attracted position, e.g. with reduced energising current

Of 5 combined children, 3 exist in both systems.

2 codes are CPC-only extensions.

Note: 1 CPC extensions are marked as secondary classification only.

1 shared codes have differing titles between IPC and CPC.

Child Classifications

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  • H01H 2047/046 2nd only CPC only CPC only
  • H01H 47/043 CPC only CPC only
  • H01H 47/06 by changing number of serially-connected turns or windings IPC+CPC Available in IPC and CPC
  • H01H 47/08 by changing number of parallel-connected turns or windings IPC+CPC Available in IPC and CPC
  • H01H 47/10 by switching-in or -out impedance external to the relay winding IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080