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Search for IPC and CPC classification codes or keywords
DIFF Subgroup
H01H 5/06

by compression or extension of coil springs

Introduced: September 1968

Full Title

Full titles differ between systems:

IPC:

Snap-action arrangements, i.e. in which during a single opening operation or a single closing operation energy is first stored and then released to produce or assist the contact movement > Energy stored by deformation of elastic members > by compression or extension of coil springs

CPC:

Snap-action arrangements, i.e. in which during a single opening operation or a single closing operation energy is first stored and then released to produce or assist the contact movement > Energy stored by deformation of elastic members (by deformation of bimetallic element in thermally-actuated switches H01H37/54) > by compression or extension of coil springs

IPC and CPC are identically structured here. All 3 subcodes exist in both systems.

1 shared codes have differing titles between IPC and CPC.

Child Classifications

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  • H01H 5/08 one end of spring transmitting movement to the contact member when the other end is moved by the operating part IPC+CPC Available in IPC and CPC
  • H01H 5/10 one end of spring being fixedly connected to the stationary or movable part of the switch and the other end reacting with a movable or stationary rigid member respectively through pins, cams, toothed or other shaped surfaces IPC+CPC Available in IPC and CPC
  • H01H 5/12 having two or more snap-action motions in succession IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080