H01H 5/24 having three legs
Introduced: September 1968
Full Title
Full titles differ between systems:
Snap-action arrangements, i.e. in which during a single opening operation or a single closing operation energy is first stored and then released to produce or assist the contact movement > Energy stored by deformation of elastic members > by flexing of blade springs > blade spring with at least one snap-acting leg and at least one separate contact-carrying or contact-actuating leg > having three legs
Snap-action arrangements, i.e. in which during a single opening operation or a single closing operation energy is first stored and then released to produce or assist the contact movement > Energy stored by deformation of elastic members (by deformation of bimetallic element in thermally-actuated switches H01H37/54) > by flexing of blade springs > blade spring with at least one snap-acting leg and at least one separate contact-carrying or contact-actuating leg > having three legs
No child classifications to compare. This is a leaf node in both IPC and CPC.
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080