DIFF Subgroup
H01K 3/20 Sealing-in wires directly into the envelope
Introduced: September 1968
Full Title
Full titles differ between systems:
IPC:
Apparatus or processes adapted to the manufacture, installing, removal or maintenance of incandescent lamps or parts thereof > Sealing-in wires directly into the envelope
CPC:
Apparatus or processes adapted to the manufacture, installing, removal, or maintenance of incandescent lamps or parts thereof (manufacture of vessels from glass C03B) > Sealing-in wires directly into the envelope
No child classifications to compare. This is a leaf node in both IPC and CPC.