DIFF Subgroup
H01S 5/0235 Method for mounting laser chips
Introduced: January 2021
Full Title
Full titles differ between systems:
IPC:
Semiconductor lasers > Structural details or components not essential to laser action > Mountings; Housings > Method for mounting laser chips
CPC:
Semiconductor lasers (superluminescent diodes H10H20/00) > Structural details or components not essential to laser action > Mountings; Housings > Method for mounting laser chips
IPC and CPC are identically structured here. All 2 subcodes exist in both systems.
IPC defines codes here since 2021.
Child Classifications
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