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DIFF Subgroup
H01S 5/02375

Positioning of the laser chips

Introduced: January 2021

Full Title

Full titles differ between systems:

IPC:

Semiconductor lasers > Structural details or components not essential to laser action > Mountings; Housings > Method for mounting laser chips > Positioning of the laser chips

CPC:

Semiconductor lasers (superluminescent diodes H10H20/00) > Structural details or components not essential to laser action > Mountings; Housings > Method for mounting laser chips > Positioning of the laser chips

IPC and CPC are identically structured here. All 2 subcodes exist in both systems.

IPC defines codes here since 2021.

Child Classifications

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  • H01S 5/0238 using marks since 2021 IPC+CPC Available in IPC and CPC
  • H01S 5/02385 using laser light as reference since 2021 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080