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DIFF Subgroup
H02B 1/04

Mounting thereon of switches or of other devices in general, the switch or device having, or being without, casing

Introduced: September 1968

Full Title

Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements > Boards, panels, desks; Parts thereof or accessories therefor > Mounting thereon of switches or of other devices in general, the switch or device having, or being without, casing

Of 5 combined children, 3 exist in both systems.

2 codes are CPC-only extensions.

IPC defines codes here since 1990.

Child Classifications

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  • H02B 1/041 CPC only CPC only

Top Applicants

Top Applicants (IPC)

Class H02,2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 54,496
  2. MITSUBISHI ELECTRIC CORPORATION JP 10,495
  3. TOYOTA MOTOR CORPORATION 9,464
  4. GUANGDONG POWER GRID CORPORATION 9,339
  5. ROBERT BOSCH DE 8,226
  6. SIEMENS DE 8,218
  7. DENSO CORPORATION 7,063
  8. MITSUBISHI ELECTRIC CORPORATION 6,619
  9. SAMSUNG ELECTRONICS COMPANY KR 5,826
  10. GREE ELECTRIC APPLIANCES 5,094

Top Applicants (CPC)

Class H02,2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 24,515
  2. MITSUBISHI ELECTRIC CORPORATION JP 11,346
  3. SIEMENS DE 9,026
  4. ROBERT BOSCH DE 9,005
  5. SAMSUNG ELECTRONICS COMPANY KR 6,729
  6. GUANGDONG POWER GRID CORPORATION 5,740
  7. DENSO CORPORATION JP 5,077
  8. LG ELECTRONICS KR 5,041
  9. LG INNOTEK COMPANY KR 4,442
  10. TOYOTA MOTOR CORPORATION 4,349