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DIFF Subgroup
H02K 15/08

Forming windings by laying conductors into or around core parts

Introduced: September 1968

Full Title

Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines > Forming windings by laying conductors into or around core parts

IPC and CPC are identically structured here. All 3 subcodes exist in both systems.

Child Classifications

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  • H02K 15/085 by laying conductors into slotted stators IPC+CPC Available in IPC and CPC
  • H02K 15/09 by laying conductors into slotted rotors IPC+CPC Available in IPC and CPC
  • H02K 15/095 by laying conductors around salient poles IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H02,2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 54,496
  2. MITSUBISHI ELECTRIC CORPORATION JP 10,495
  3. TOYOTA MOTOR CORPORATION 9,464
  4. GUANGDONG POWER GRID CORPORATION 9,339
  5. ROBERT BOSCH DE 8,226
  6. SIEMENS DE 8,218
  7. DENSO CORPORATION 7,063
  8. MITSUBISHI ELECTRIC CORPORATION 6,619
  9. SAMSUNG ELECTRONICS COMPANY KR 5,826
  10. GREE ELECTRIC APPLIANCES 5,094

Top Applicants (CPC)

Class H02,2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 24,515
  2. MITSUBISHI ELECTRIC CORPORATION JP 11,346
  3. SIEMENS DE 9,026
  4. ROBERT BOSCH DE 9,005
  5. SAMSUNG ELECTRONICS COMPANY KR 6,729
  6. GUANGDONG POWER GRID CORPORATION 5,740
  7. DENSO CORPORATION JP 5,077
  8. LG ELECTRONICS KR 5,041
  9. LG INNOTEK COMPANY KR 4,442
  10. TOYOTA MOTOR CORPORATION 4,349