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DIFF Subgroup
H02K 15/20

Shaping or compacting conductors or winding heads after the installation of the winding in the cores or machines; Applying fastening means on winding heads

Introduced: January 2025

Full Title

Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines > Shaping or compacting conductors or winding heads after the installation of the winding in the cores or machines; Applying fastening means on winding heads

IPC and CPC are identically structured here. All 3 subcodes exist in both systems.

2 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 2025.

Child Classifications

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  • H02K 15/22 Shaping or compacting conductors in slots or around salient poles (H02K15/28 takes precedence) since 2025 IPC+CPC Available in IPC and CPC
  • H02K 15/28 using electrodynamic forces since 2025 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H02,2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 54,496
  2. MITSUBISHI ELECTRIC CORPORATION JP 10,495
  3. TOYOTA MOTOR CORPORATION 9,464
  4. GUANGDONG POWER GRID CORPORATION 9,339
  5. ROBERT BOSCH DE 8,226
  6. SIEMENS DE 8,218
  7. DENSO CORPORATION 7,063
  8. MITSUBISHI ELECTRIC CORPORATION 6,619
  9. SAMSUNG ELECTRONICS COMPANY KR 5,826
  10. GREE ELECTRIC APPLIANCES 5,094

Top Applicants (CPC)

Class H02,2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 24,515
  2. MITSUBISHI ELECTRIC CORPORATION JP 11,346
  3. SIEMENS DE 9,026
  4. ROBERT BOSCH DE 9,005
  5. SAMSUNG ELECTRONICS COMPANY KR 6,729
  6. GUANGDONG POWER GRID CORPORATION 5,740
  7. DENSO CORPORATION JP 5,077
  8. LG ELECTRONICS KR 5,041
  9. LG INNOTEK COMPANY KR 4,442
  10. TOYOTA MOTOR CORPORATION 4,349