DIFF Subgroup Additional Only
H02K 2203/03 Machines characterised by the wiring boards, i.e. printed circuit boards or similar structures for connecting the winding terminations
Full Title
Specific aspects not provided for in the other groups of this subclass relating to the windings > Machines characterised by the wiring boards, i.e. printed circuit boards or similar structures for connecting the winding terminations
Top Applicants
Top Applicants (IPC)
Class H02,2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 54,496
- MITSUBISHI ELECTRIC CORPORATION JP 10,495
- TOYOTA MOTOR CORPORATION 9,464
- GUANGDONG POWER GRID CORPORATION 9,339
- ROBERT BOSCH DE 8,226
- SIEMENS DE 8,218
- DENSO CORPORATION 7,063
- MITSUBISHI ELECTRIC CORPORATION 6,619
- SAMSUNG ELECTRONICS COMPANY KR 5,826
- GREE ELECTRIC APPLIANCES 5,094
Top Applicants (CPC)
Class H02,2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 24,515
- MITSUBISHI ELECTRIC CORPORATION JP 11,346
- SIEMENS DE 9,026
- ROBERT BOSCH DE 9,005
- SAMSUNG ELECTRONICS COMPANY KR 6,729
- GUANGDONG POWER GRID CORPORATION 5,740
- DENSO CORPORATION JP 5,077
- LG ELECTRONICS KR 5,041
- LG INNOTEK COMPANY KR 4,442
- TOYOTA MOTOR CORPORATION 4,349