DIFF Subgroup
H02K 5/207 Full Title
Casings; Enclosures; Supports > Casings or enclosures characterised by the shape, form or construction thereof > with channels or ducts for flow of cooling medium
Top Applicants
Top Applicants (IPC)
Class H02,2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 54,496
- MITSUBISHI ELECTRIC CORPORATION JP 10,495
- TOYOTA MOTOR CORPORATION 9,464
- GUANGDONG POWER GRID CORPORATION 9,339
- ROBERT BOSCH DE 8,226
- SIEMENS DE 8,218
- DENSO CORPORATION 7,063
- MITSUBISHI ELECTRIC CORPORATION 6,619
- SAMSUNG ELECTRONICS COMPANY KR 5,826
- GREE ELECTRIC APPLIANCES 5,094
Top Applicants (CPC)
Class H02,2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 24,515
- MITSUBISHI ELECTRIC CORPORATION JP 11,346
- SIEMENS DE 9,026
- ROBERT BOSCH DE 9,005
- SAMSUNG ELECTRONICS COMPANY KR 6,729
- GUANGDONG POWER GRID CORPORATION 5,740
- DENSO CORPORATION JP 5,077
- LG ELECTRONICS KR 5,041
- LG INNOTEK COMPANY KR 4,442
- TOYOTA MOTOR CORPORATION 4,349