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DIFF Subgroup
H02K 9/20

wherein the cooling medium vaporises within the machine casing

Introduced: September 1968

Full Title

Full titles differ between systems:

IPC:

Arrangements for cooling or ventilating > for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil > wherein the cooling medium vaporises within the machine casing

CPC:

Arrangements for cooling or ventilating (channels or ducts in parts of the magnetic circuit H02K1/20, H02K1/32; channels or ducts in or between conductors H02K3/22, H02K3/24) > for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil > wherein the cooling medium vaporises within the machine casing

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H02,2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 54,496
  2. MITSUBISHI ELECTRIC CORPORATION JP 10,495
  3. TOYOTA MOTOR CORPORATION 9,464
  4. GUANGDONG POWER GRID CORPORATION 9,339
  5. ROBERT BOSCH DE 8,226
  6. SIEMENS DE 8,218
  7. DENSO CORPORATION 7,063
  8. MITSUBISHI ELECTRIC CORPORATION 6,619
  9. SAMSUNG ELECTRONICS COMPANY KR 5,826
  10. GREE ELECTRIC APPLIANCES 5,094

Top Applicants (CPC)

Class H02,2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 24,515
  2. MITSUBISHI ELECTRIC CORPORATION JP 11,346
  3. SIEMENS DE 9,026
  4. ROBERT BOSCH DE 9,005
  5. SAMSUNG ELECTRONICS COMPANY KR 6,729
  6. GUANGDONG POWER GRID CORPORATION 5,740
  7. DENSO CORPORATION JP 5,077
  8. LG ELECTRONICS KR 5,041
  9. LG INNOTEK COMPANY KR 4,442
  10. TOYOTA MOTOR CORPORATION 4,349