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DIFF Subgroup
H03B 19/18

and elements comprising distributed inductance and capacitance

Introduced: January 1980

Full Title

Full titles differ between systems:

IPC:

Generation of oscillations by non-regenerative frequency multiplication or division of a signal from a separate source > using uncontrolled rectifying devices, e.g. rectifying diodes or Schottky diodes > and elements comprising distributed inductance and capacitance

CPC:

Generation of oscillations by non-regenerative frequency multiplication or division of a signal from a separate source (transference of modulation from one carrier to another H03D7/00) > using uncontrolled rectifying devices, e.g. rectifying diodes or Schottky diodes > and elements comprising distributed inductance and capacitance

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 5,625
  2. SAMSUNG ELECTRONICS COMPANY KR 5,496
  3. MURATA MANUFACTURING COMPANY JP 5,478
  4. HUAWEI TECHNOLOGIES COMPANY CN 3,383
  5. INTEL CORPORATION US 3,091
  6. TEXAS INSTRUMENTS US 3,070
  7. MURATA MANUFACTURING COMPANY 2,722
  8. SKYWORKS SOLUTIONS US 2,290
  9. SEIKO EPSON CORPORATION 2,177
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,158

Top Applicants (CPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,293
  2. QUALCOMM US 7,085
  3. MURATA MANUFACTURING COMPANY JP 5,982
  4. HUAWEI TECHNOLOGIES COMPANY CN 4,641
  5. INTEL CORPORATION US 3,863
  6. TEXAS INSTRUMENTS US 3,409
  7. MURATA MANUFACTURING COMPANY 2,874
  8. SK HYNIX KR 2,644
  9. SKYWORKS SOLUTIONS US 2,545
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437