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DIFF Subgroup
H03C 3/08

Modifications of modulator to linearise modulation, e.g. by feedback, and clearly applicable to more than one type of modulator

Introduced: September 1968

Full Title

Full titles differ between systems:

IPC:

Angle modulation > Details > Modifications of modulator to linearise modulation, e.g. by feedback, and clearly applicable to more than one type of modulator

CPC:

Angle modulation (H03C5/00, H03C7/00 take precedence) > Details > Modifications of modulator to linearise modulation, e.g. by feedback, and clearly applicable to more than one type of modulator

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 5,625
  2. SAMSUNG ELECTRONICS COMPANY KR 5,496
  3. MURATA MANUFACTURING COMPANY JP 5,478
  4. HUAWEI TECHNOLOGIES COMPANY CN 3,383
  5. INTEL CORPORATION US 3,091
  6. TEXAS INSTRUMENTS US 3,070
  7. MURATA MANUFACTURING COMPANY 2,722
  8. SKYWORKS SOLUTIONS US 2,290
  9. SEIKO EPSON CORPORATION 2,177
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,158

Top Applicants (CPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,293
  2. QUALCOMM US 7,085
  3. MURATA MANUFACTURING COMPANY JP 5,982
  4. HUAWEI TECHNOLOGIES COMPANY CN 4,641
  5. INTEL CORPORATION US 3,863
  6. TEXAS INSTRUMENTS US 3,409
  7. MURATA MANUFACTURING COMPANY 2,874
  8. SK HYNIX KR 2,644
  9. SKYWORKS SOLUTIONS US 2,545
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437