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DIFF Subgroup
H03D 9/06

Transference of modulation using distributed inductance and capacitance

Introduced: September 1968

Full Title

Full titles differ between systems:

IPC:

Demodulation or transference of modulation of modulated electromagnetic waves > Transference of modulation using distributed inductance and capacitance

CPC:

Demodulation or transference of modulation of modulated electromagnetic waves (demodulating light, transferring modulation in light waves G02F2/00) > Transference of modulation using distributed inductance and capacitance

Of 4 combined children, 0 exist in both systems.

4 codes are CPC-only extensions.

Note: 1 CPC extensions are marked as secondary classification only.

Child Classifications

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Top Applicants

Top Applicants (IPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 5,625
  2. SAMSUNG ELECTRONICS COMPANY KR 5,496
  3. MURATA MANUFACTURING COMPANY JP 5,478
  4. HUAWEI TECHNOLOGIES COMPANY CN 3,383
  5. INTEL CORPORATION US 3,091
  6. TEXAS INSTRUMENTS US 3,070
  7. MURATA MANUFACTURING COMPANY 2,722
  8. SKYWORKS SOLUTIONS US 2,290
  9. SEIKO EPSON CORPORATION 2,177
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,158

Top Applicants (CPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,293
  2. QUALCOMM US 7,085
  3. MURATA MANUFACTURING COMPANY JP 5,982
  4. HUAWEI TECHNOLOGIES COMPANY CN 4,641
  5. INTEL CORPORATION US 3,863
  6. TEXAS INSTRUMENTS US 3,409
  7. MURATA MANUFACTURING COMPANY 2,874
  8. SK HYNIX KR 2,644
  9. SKYWORKS SOLUTIONS US 2,545
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437