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DIFF Subgroup
H03G 1/02

Remote control of amplification, tone or bandwidth (combined with remote tuning or selection of resonant circuits H03J)

Introduced: September 1968

Title

Titles differ between systems:

IPC: Remote control of amplification, tone or bandwidth

CPC: Remote control of amplification, tone or bandwidth (combined with remote tuning or selection of resonant circuits H03J)

Full Title

Full titles differ between systems:

IPC:

Details of arrangements for controlling amplification > Remote control of amplification, tone or bandwidth

CPC:

Details of arrangements for controlling amplification > Remote control of amplification, tone or bandwidth (combined with remote tuning or selection of resonant circuits H03J)

Additional Content IPC

Remote control combined with remote tuning or selection of resonant circuits

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 5,625
  2. SAMSUNG ELECTRONICS COMPANY KR 5,496
  3. MURATA MANUFACTURING COMPANY JP 5,478
  4. HUAWEI TECHNOLOGIES COMPANY CN 3,383
  5. INTEL CORPORATION US 3,091
  6. TEXAS INSTRUMENTS US 3,070
  7. MURATA MANUFACTURING COMPANY 2,722
  8. SKYWORKS SOLUTIONS US 2,290
  9. SEIKO EPSON CORPORATION 2,177
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,158

Top Applicants (CPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,293
  2. QUALCOMM US 7,085
  3. MURATA MANUFACTURING COMPANY JP 5,982
  4. HUAWEI TECHNOLOGIES COMPANY CN 4,641
  5. INTEL CORPORATION US 3,863
  6. TEXAS INSTRUMENTS US 3,409
  7. MURATA MANUFACTURING COMPANY 2,874
  8. SK HYNIX KR 2,644
  9. SKYWORKS SOLUTIONS US 2,545
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437