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DIFF Subgroup
H03H 2/005

Full Title

Networks using elements or techniques not provided for in groups H03H3/00 - H03H21/00

Of 2 combined children, 0 exist in both systems.

2 codes are CPC-only extensions.

Top Applicants

Top Applicants (IPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 5,625
  2. SAMSUNG ELECTRONICS COMPANY KR 5,496
  3. MURATA MANUFACTURING COMPANY JP 5,478
  4. HUAWEI TECHNOLOGIES COMPANY CN 3,383
  5. INTEL CORPORATION US 3,091
  6. TEXAS INSTRUMENTS US 3,070
  7. MURATA MANUFACTURING COMPANY 2,722
  8. SKYWORKS SOLUTIONS US 2,290
  9. SEIKO EPSON CORPORATION 2,177
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,158

Top Applicants (CPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,293
  2. QUALCOMM US 7,085
  3. MURATA MANUFACTURING COMPANY JP 5,982
  4. HUAWEI TECHNOLOGIES COMPANY CN 4,641
  5. INTEL CORPORATION US 3,863
  6. TEXAS INSTRUMENTS US 3,409
  7. MURATA MANUFACTURING COMPANY 2,874
  8. SK HYNIX KR 2,644
  9. SKYWORKS SOLUTIONS US 2,545
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437