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DIFF Subgroup
H03H 9/76

Networks using surface acoustic waves

Introduced: January 1980

Full Title

Full titles differ between systems:

IPC:

Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators > Multiple-port networks for connecting several sources or loads, working on the same frequency or frequency band, to a common load or source > Networks using surface acoustic waves

CPC:

Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators (electro-acoustic transducers such as loudspeakers, microphones or gramophone pick-ups H04R; piezoelectric, electrostrictive or magnetostrictive devices with mechanical input or output, e.g. actuators or sensors, H10N30/00, H10N35/00) > Multiple-port networks for connecting several sources or loads, working on the same frequency or frequency band, to a common load or source (networks for phase shifting H03H9/66) > Networks using surface acoustic waves

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 5,625
  2. SAMSUNG ELECTRONICS COMPANY KR 5,496
  3. MURATA MANUFACTURING COMPANY JP 5,478
  4. HUAWEI TECHNOLOGIES COMPANY CN 3,383
  5. INTEL CORPORATION US 3,091
  6. TEXAS INSTRUMENTS US 3,070
  7. MURATA MANUFACTURING COMPANY 2,722
  8. SKYWORKS SOLUTIONS US 2,290
  9. SEIKO EPSON CORPORATION 2,177
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,158

Top Applicants (CPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,293
  2. QUALCOMM US 7,085
  3. MURATA MANUFACTURING COMPANY JP 5,982
  4. HUAWEI TECHNOLOGIES COMPANY CN 4,641
  5. INTEL CORPORATION US 3,863
  6. TEXAS INSTRUMENTS US 3,409
  7. MURATA MANUFACTURING COMPANY 2,874
  8. SK HYNIX KR 2,644
  9. SKYWORKS SOLUTIONS US 2,545
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437