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DIFF Subgroup
H03K 19/0175

Coupling arrangements; Interface arrangements (interface arrangements for digital computers G06F3/00, G06F13/00)

Introduced: January 1990

Title

Titles differ between systems:

IPC: Coupling arrangements; Interface arrangements

CPC: Coupling arrangements; Interface arrangements (interface arrangements for digital computers G06F3/00, G06F13/00)

Full Title

Full titles differ between systems:

IPC:

Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits > Coupling arrangements; Interface arrangements

CPC:

Logic circuits, i.e. having at least two inputs acting on one output (circuits for computer systems using fuzzy logic G06N7/02); Inverting circuits > Coupling arrangements; Interface arrangements (interface arrangements for digital computers G06F3/00, G06F13/00)

CPC subdivides this area 3x more granularly than IPC with 4 additional codes.

4 codes are CPC-only extensions.

1 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 1990.

Child Classifications

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Top Applicants

Top Applicants (IPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 5,625
  2. SAMSUNG ELECTRONICS COMPANY KR 5,496
  3. MURATA MANUFACTURING COMPANY JP 5,478
  4. HUAWEI TECHNOLOGIES COMPANY CN 3,383
  5. INTEL CORPORATION US 3,091
  6. TEXAS INSTRUMENTS US 3,070
  7. MURATA MANUFACTURING COMPANY 2,722
  8. SKYWORKS SOLUTIONS US 2,290
  9. SEIKO EPSON CORPORATION 2,177
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,158

Top Applicants (CPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,293
  2. QUALCOMM US 7,085
  3. MURATA MANUFACTURING COMPANY JP 5,982
  4. HUAWEI TECHNOLOGIES COMPANY CN 4,641
  5. INTEL CORPORATION US 3,863
  6. TEXAS INSTRUMENTS US 3,409
  7. MURATA MANUFACTURING COMPANY 2,874
  8. SK HYNIX KR 2,644
  9. SKYWORKS SOLUTIONS US 2,545
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437