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DIFF Subgroup
H03K 19/17752

for hot reconfiguration

Introduced: January 2020

Full Title

Full titles differ between systems:

IPC:

Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits > using specified components > using elementary logic circuits as components > arranged in matrix form > Structural details of configuration resources > for hot reconfiguration

CPC:

Logic circuits, i.e. having at least two inputs acting on one output (circuits for computer systems using fuzzy logic G06N7/02); Inverting circuits > using specified components (, H03K19/003 - H03K19/0175 take precedence) > using elementary logic circuits as components > arranged in matrix form > Structural details of configuration resources > for hot reconfiguration

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 5,625
  2. SAMSUNG ELECTRONICS COMPANY KR 5,496
  3. MURATA MANUFACTURING COMPANY JP 5,478
  4. HUAWEI TECHNOLOGIES COMPANY CN 3,383
  5. INTEL CORPORATION US 3,091
  6. TEXAS INSTRUMENTS US 3,070
  7. MURATA MANUFACTURING COMPANY 2,722
  8. SKYWORKS SOLUTIONS US 2,290
  9. SEIKO EPSON CORPORATION 2,177
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,158

Top Applicants (CPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,293
  2. QUALCOMM US 7,085
  3. MURATA MANUFACTURING COMPANY JP 5,982
  4. HUAWEI TECHNOLOGIES COMPANY CN 4,641
  5. INTEL CORPORATION US 3,863
  6. TEXAS INSTRUMENTS US 3,409
  7. MURATA MANUFACTURING COMPANY 2,874
  8. SK HYNIX KR 2,644
  9. SKYWORKS SOLUTIONS US 2,545
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437