H03K 19/17752 for hot reconfiguration
Introduced: January 2020
Full Title
Full titles differ between systems:
Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits > using specified components > using elementary logic circuits as components > arranged in matrix form > Structural details of configuration resources > for hot reconfiguration
Logic circuits, i.e. having at least two inputs acting on one output (circuits for computer systems using fuzzy logic G06N7/02); Inverting circuits > using specified components (, H03K19/003 - H03K19/0175 take precedence) > using elementary logic circuits as components > arranged in matrix form > Structural details of configuration resources > for hot reconfiguration
No child classifications to compare. This is a leaf node in both IPC and CPC.
Top Applicants
Top Applicants (IPC)
Class H03,2013–2023, worldwide · Source: EPO PATSTAT
- QUALCOMM US 5,625
- SAMSUNG ELECTRONICS COMPANY KR 5,496
- MURATA MANUFACTURING COMPANY JP 5,478
- HUAWEI TECHNOLOGIES COMPANY CN 3,383
- INTEL CORPORATION US 3,091
- TEXAS INSTRUMENTS US 3,070
- MURATA MANUFACTURING COMPANY 2,722
- SKYWORKS SOLUTIONS US 2,290
- SEIKO EPSON CORPORATION 2,177
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,158
Top Applicants (CPC)
Class H03,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 7,293
- QUALCOMM US 7,085
- MURATA MANUFACTURING COMPANY JP 5,982
- HUAWEI TECHNOLOGIES COMPANY CN 4,641
- INTEL CORPORATION US 3,863
- TEXAS INSTRUMENTS US 3,409
- MURATA MANUFACTURING COMPANY 2,874
- SK HYNIX KR 2,644
- SKYWORKS SOLUTIONS US 2,545
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437