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DIFF Subgroup
H03K 5/007

Base line stabilisation (thresholding H03K5/08)

Introduced: January 1995

Title

Titles differ between systems:

IPC: Base line stabilisation

CPC: Base line stabilisation (thresholding H03K5/08)

Full Title

Full titles differ between systems:

IPC:

Manipulation of pulses not covered by one of the other main groups of this subclass > Changing the DC level > Base line stabilisation

CPC:

Manipulating of pulses not covered by one of the other main groups of this subclass (circuits with regenerative action H03K3/00, H03K4/00; by the use of non-linear magnetic or dielectric devices H03K3/45) > Changing the DC level (reinsertion of DC component of a television signal H04N5/16) > Base line stabilisation (thresholding H03K5/08)

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 5,625
  2. SAMSUNG ELECTRONICS COMPANY KR 5,496
  3. MURATA MANUFACTURING COMPANY JP 5,478
  4. HUAWEI TECHNOLOGIES COMPANY CN 3,383
  5. INTEL CORPORATION US 3,091
  6. TEXAS INSTRUMENTS US 3,070
  7. MURATA MANUFACTURING COMPANY 2,722
  8. SKYWORKS SOLUTIONS US 2,290
  9. SEIKO EPSON CORPORATION 2,177
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,158

Top Applicants (CPC)

Class H03,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,293
  2. QUALCOMM US 7,085
  3. MURATA MANUFACTURING COMPANY JP 5,982
  4. HUAWEI TECHNOLOGIES COMPANY CN 4,641
  5. INTEL CORPORATION US 3,863
  6. TEXAS INSTRUMENTS US 3,409
  7. MURATA MANUFACTURING COMPANY 2,874
  8. SK HYNIX KR 2,644
  9. SKYWORKS SOLUTIONS US 2,545
  10. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 2,437