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PCE
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DIFF Subgroup
H04L 69/322

Intralayer communication protocols among peer entities or protocol data unit [PDU] definitions

Introduced: January 2022

Full Title

Full titles differ between systems:

IPC:

Network arrangements, protocols or services independent of the application payload and not provided for in the other groups of this subclass > Definitions, standards or architectural aspects of layered protocol stacks > Architecture of open systems interconnection [OSI] 7-layer type protocol stacks, e.g. the interfaces between the data link level and the physical level > Intralayer communication protocols among peer entities or protocol data unit [PDU] definitions

CPC:

Network arrangements, protocols or services independent of the application payload and not provided for in the other groups of this subclass (networks security protocols H04L9/40; wireless communication networks H04W) > Definitions, standards or architectural aspects of layered protocol stacks > Architecture of open systems interconnection [OSI] 7-layer type protocol stacks, e.g. the interfaces between the data link level and the physical level > Intralayer communication protocols among peer entities or protocol data unit [PDU] definitions

IPC and CPC are identically structured here. All 7 subcodes exist in both systems.

2 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 2022.

Child Classifications

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  • H04L 69/323 in the physical layer [OSI layer 1] since 2022 IPC+CPC Available in IPC and CPC
  • H04L 69/324 in the data link layer [OSI layer 2], e.g. HDLC since 2022 IPC+CPC Available in IPC and CPC
  • H04L 69/325 in the network layer [OSI layer 3], e.g. X.25 (H04L69/16 takes precedence) since 2022 IPC+CPC Available in IPC and CPC
  • H04L 69/326 in the transport layer [OSI layer 4] (H04L69/16 takes precedence) since 2022 IPC+CPC Available in IPC and CPC
  • H04L 69/327 in the session layer [OSI layer 5] since 2022 IPC+CPC Available in IPC and CPC
  • H04L 69/328 in the presentation layer [OSI layer 6] since 2022 IPC+CPC Available in IPC and CPC
  • H04L 69/329 in the application layer [OSI layer 7] since 2022 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H04,2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 97,396
  2. HUAWEI TECHNOLOGIES COMPANY CN 96,502
  3. SAMSUNG ELECTRONICS COMPANY KR 86,981
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
  5. HUAWEI TECHNOLOGIES COMPANY 55,349
  6. LG ELECTRONICS KR 53,649
  7. CANON 33,341
  8. SONY CORPORATION JP 32,761
  9. ZTE CORPORATION CN 32,274
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327

Top Applicants (CPC)

Class H04,2013–2023, worldwide · Source: EPO PATSTAT

  1. HUAWEI TECHNOLOGIES COMPANY CN 101,476
  2. QUALCOMM US 101,139
  3. SAMSUNG ELECTRONICS COMPANY KR 96,655
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
  5. LG ELECTRONICS KR 55,253
  6. HUAWEI TECHNOLOGIES COMPANY 54,181
  7. SONY CORPORATION JP 35,309
  8. ZTE CORPORATION CN 32,950
  9. INTEL CORPORATION US 27,533
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498