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DIFF Subgroup
H10N 10/817

the junction being non-separable, e.g. being cemented, sintered or soldered

Introduced: January 2023

Title

Titles differ between systems:

IPC: the junction being non- separable, e.g. being cemented, sintered or soldered

CPC: the junction being non-separable, e.g. being cemented, sintered or soldered

Full Title

Full titles differ between systems:

IPC:

Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects > Constructional details > Structural details of the junction > the junction being non- separable, e.g. being cemented, sintered or soldered

CPC:

Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects (integrated devices or assemblies of multiple devices H10N19/00) > Constructional details > Structural details of the junction > the junction being non-separable, e.g. being cemented, sintered or soldered

No child classifications to compare. This is a leaf node in both IPC and CPC.