H10N 10/817 the junction being non-separable, e.g. being cemented, sintered or soldered
Introduced: January 2023
Title
Titles differ between systems:
IPC: the junction being non- separable, e.g. being cemented, sintered or soldered
CPC: the junction being non-separable, e.g. being cemented, sintered or soldered
Full Title
Full titles differ between systems:
Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects > Constructional details > Structural details of the junction > the junction being non- separable, e.g. being cemented, sintered or soldered
Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects (integrated devices or assemblies of multiple devices H10N19/00) > Constructional details > Structural details of the junction > the junction being non-separable, e.g. being cemented, sintered or soldered
No child classifications to compare. This is a leaf node in both IPC and CPC.