DIFF Subgroup
H10P 30/208 Full Title
Ion implantation into wafers, substrates or parts of devices > into semiconductor materials, e.g. for doping
Of 1 combined children, 0 exist in both systems.
1 codes are CPC-only extensions.
H10P 30/208 Ion implantation into wafers, substrates or parts of devices > into semiconductor materials, e.g. for doping
Of 1 combined children, 0 exist in both systems.
1 codes are CPC-only extensions.