Diffusion of dopants within, into or out of wafers, substrates or parts of devices (during formation of materials H10P14/00)

Introduced: January 2026

Title

Titles differ between systems:

IPC: Diffusion of dopants within, into, or out of wafers, substrates or parts of devices

CPC: Diffusion of dopants within, into or out of wafers, substrates or parts of devices (during formation of materials H10P14/00)

Full titles differ between systems:

IPC:

Diffusion of dopants within, into, or out of wafers, substrates or parts of devices

CPC:

Diffusion of dopants within, into or out of wafers, substrates or parts of devices (during formation of materials H10P14/00)

IPC and CPC are identically structured here. All 3 subcodes exist in both systems.

IPC defines codes here since 2026.

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H10P 32/10 Diffusion of dopants within, into or out of semiconductor bodies or layers since 2026 +5 CPC IPC+CPC Available in IPC and CPC
H10P 32/20 Diffusion for doping of insulating layers since 2026 IPC+CPC Available in IPC and CPC
H10P 32/30 Diffusion for doping of conductive or resistive layers since 2026 +1 CPC IPC+CPC Available in IPC and CPC

Class H10,2013–2023, worldwide · Source: EPO PATSTAT

Class H10,2013–2023, worldwide · Source: EPO PATSTAT