DIFF Main Group
H10P 32/00 Diffusion of dopants within, into or out of wafers, substrates or parts of devices (during formation of materials H10P14/00)
Introduced: January 2026
Title
Titles differ between systems:
IPC: Diffusion of dopants within, into, or out of wafers, substrates or parts of devices
CPC: Diffusion of dopants within, into or out of wafers, substrates or parts of devices (during formation of materials H10P14/00)
Full Title
Full titles differ between systems:
IPC:
Diffusion of dopants within, into, or out of wafers, substrates or parts of devices
CPC:
Diffusion of dopants within, into or out of wafers, substrates or parts of devices (during formation of materials H10P14/00)
IPC and CPC are identically structured here. All 3 subcodes exist in both systems.
IPC defines codes here since 2026.
Child Classifications
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- H10P 32/10 Diffusion of dopants within, into or out of semiconductor bodies or layers since 2026 +5 CPC IPC+CPC Available in IPC and CPC
- H10P 32/30 Diffusion for doping of conductive or resistive layers since 2026 +1 CPC IPC+CPC Available in IPC and CPC