H10P 90/19 — IPC vs CPC Diff | Patent Classification Explorer

DIFF Subgroup

H10P 90/19

Full Title

Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement

Of 2 combined children, 0 exist in both systems.

2 codes are CPC-only extensions.

This code exists only in CPC.

Diff view requires codes present in both systems.