DIFF Subgroup
H10P 90/1906 Full Title
Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
Of 6 combined children, 0 exist in both systems.
6 codes are CPC-only extensions.
H10P 90/1906 Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
Of 6 combined children, 0 exist in both systems.
6 codes are CPC-only extensions.