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IPC Subgroup
B65B 27/06

Bundling coils of wire or like annular objects

Introduced: September 1968

Last revised: January 2006

Full Title

Bundling particular articles presenting special problems using string, wire, or narrow tape or band; Baling fibrous material, e.g. peat, not otherwise provided for > Bundling coils of wire or like annular objects

Classification Context

Section:
PERFORMING OPERATIONS; TRANSPORTING
Class:
CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
Subclass:
MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING

Filing statistics

IPC B65B 27/06 belongs to the parent subclass B65B, which recorded 334,731 patent applications worldwide between 2013 and 2023. Annual filings grew from 13,632 in 2013 to 41,539 in 2023 (+205%), peaking at 45,273 applications in 2020. The most active applicants in class B65 are CANON (3,755 applications), SGCC(STATE GRID CORPORATION OF CHINA) (3,721 applications) and YOSHINO KOGYOSHO COMPANY (3,659 applications).

Source: EPO PATSTAT, worldwide filings

Related Keywords

bundling coils of WIRE(S)

Top Applicants

Top 10 applicants by patent filingsfor class B65, 2013–2023, worldwide · Source: EPO PATSTAT

  1. CANON 3,755
  2. SGCC(STATE GRID CORPORATION OF CHINA) 3,721
  3. YOSHINO KOGYOSHO COMPANY 3,659
  4. DNP (DAINIPPON PRINTING COMPANY) 3,573
  5. KRONES DE 3,114
  6. P&G (PROCTER & GAMBLE COMPANY) US 2,777
  7. TOPPAN PRINTING COMPANY 2,720
  8. SEIKO EPSON CORPORATION 2,574
  9. KYOCERA DOCUMENT SOLUTIONS 2,371
  10. RICOH COMPANY 2,349