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IPC Main Group
C09J 7/00

Adhesives in the form of films or foils

Introduced: September 1968

Last revised: January 2018

Classification Context

Section:
CHEMISTRY; METALLURGY
Class:
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
Subclass:
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES

Additional Content

Glossary

pressure-sensitive adhesive pressure-sensitive adhesives pressure-sensitive adhesive (PSA, self-adhesive, self-stick adhesive) is adhesive which forms a bond when pressure is applied to adhere the adhesive with the adherend. No solvent, water or heat is needed to activate the adhesive. metallised plastic metallised plastics metallised plastics are plastics coated with a thin layer of metal, usually aluminium. Metallisation is generally performed using physical vapour deposition, plating or thermal/cold spraying processes. This coating is much thinner than a metal foil could be made, in the range of 0.5 micrometres. heat-activated adhesives heat-activated adhesive heat-activated adhesives are designed to bond parts or components through the use of heat (over 50 ℃)

Application references

Hook-and-loop fastener tapes Adhesive bandages or dressings Surgical adhesives or cements; Adhesives for colostomy devices Layered products characterised by the connection between layers using an adhesive Labels fastened or secured by an adhesive layer Sealing materials for batteries Back sheets for solar cell panels Protecting or reinforcing the surface of semiconductor wafers or substrates for semiconductor or solid-state devices during cutting or separating, e.g. using adhesive tapes , Wafer tapes

Related Keywords

ADHESIVE(S) films or foils

5 direct subcodes

Child Classifications

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  • C09J 7/1 without carriers
  • C09J 7/4 characterised by release liners
  • C09J 7/5 characterised by a primer layer between the carrier and the adhesive

Top Applicants

Top 10 applicants by patent filingsfor class C09, 2013–2023, worldwide · Source: EPO PATSTAT

  1. LG CHEM KR 6,420
  2. NITTO DENKO CORPORATION JP 5,752
  3. HALLIBURTON ENERGY SERVICES GROUP US 5,650
  4. 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 5,635
  5. DOW GLOBAL TECHNOLOGIES US 4,844
  6. MERCK PATENT DE 4,779
  7. CHINESE ACADEMY OF SCIENCES 4,311
  8. FUJIFILM JP 4,205
  9. BASF (BADISCHE ANILIN & SODA FABRIK) DE 4,039
  10. SINOPEC (CHINA PETROCHEMICAL CORPORATION) 3,931