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IPC Subgroup
E04C 2/4

composed of a number of smaller components rigidly or movably connected together, e.g. interlocking, hingedly connected

Introduced: September 1968

Last revised: January 2006

Full Title

Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels > characterised by the shape or structure > composed of a number of smaller components rigidly or movably connected together, e.g. interlocking, hingedly connected

Classification Context

Section:
FIXED CONSTRUCTIONS
Class:
BUILDING
Subclass:
STRUCTURAL ELEMENTS; BUILDING MATERIALS

Filing statistics

IPC E04C 2/4 belongs to the parent subclass E04C, which recorded 124,823 patent applications worldwide between 2013 and 2023. Annual filings grew from 6,510 in 2013 to 15,263 in 2023 (+134%), peaking at 15,370 applications in 2021. The most active applicants in class E04 are CHINA CONSTRUCTION EIGHTH ENGINEERING DIVISION (6,575 applications), ZHEJIANG YASHA DECORATION COMPANY (4,488 applications) and SGCC(STATE GRID CORPORATION OF CHINA) (4,427 applications).

Source: EPO PATSTAT, worldwide filings

Top Applicants

Top 10 applicants by patent filingsfor class E04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. CHINA CONSTRUCTION EIGHTH ENGINEERING DIVISION 6,575
  2. ZHEJIANG YASHA DECORATION COMPANY 4,488
  3. SGCC(STATE GRID CORPORATION OF CHINA) 4,427
  4. CHINA CONSTRUCTION SECOND ENGINEERING BUREAU 4,352
  5. CHINA MCC17 GROUP COMPANY 3,122
  6. GOLD MANTIS FINE DECORATION TECHNOLOGY (SUZHOU) COMPANY 2,605
  7. SHENYANG JIANZHU UNIVERSITY 2,420
  8. CHINA CONSTRUCTION SEVENTH ENGINEERING DIVISION COMPANY 2,284
  9. CHINA CONSTRUCTION FIFTH ENGINEERING DIVISION CORPORATION 2,008
  10. CHINA CONSTRUCTION FIRST BUILDING (GROUP) CORPORATION 1,967