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IPC Main Group
H01R 11/00

Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts

Introduced: September 1968

Last revised: January 2006

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC ELEMENTS
Subclass:
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

Filing statistics

IPC H01R 11/00 belongs to the parent subclass H01R, which recorded 480,976 patent applications worldwide between 2013 and 2023. Annual filings grew from 29,386 in 2013 to 56,173 in 2023 (+91%). The most active applicants in class H01 are TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (43,574 applications), SAMSUNG ELECTRONICS COMPANY (42,206 applications) and LG CHEM (21,383 applications).

Source: EPO PATSTAT, worldwide filings

Related Keywords

BLOCK(S) of associated electrical connectionsEND-PIECES of wires or cables for electric connection

3 direct subcodes

Child Classifications

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  • H01R 11/01 characterised by the form or arrangement of the conductive interconnection between their connecting locations

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634