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IPC Subgroup
H01T 13/4

structurally combined with other devices

Introduced: September 1968

Last revised: January 2006

Full Title

Sparking plugs > structurally combined with other devices

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC ELEMENTS
Subclass:
SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES

Filing statistics

IPC H01T 13/4 belongs to the parent subclass H01T, which recorded 19,856 patent applications worldwide between 2013 and 2023. Annual filings declined from 1,542 in 2013 to 1,440 in 2023 (-7%), peaking at 2,172 applications in 2020. The most active applicants in class H01 are TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (43,574 applications), SAMSUNG ELECTRONICS COMPANY (42,206 applications) and LG CHEM (21,383 applications).

Source: EPO PATSTAT, worldwide filings

Additional Content

Sparking plugs structurally associated with fuel injectors Structurally combined with other parts of internal-combustion engines

3 direct subcodes

Child Classifications

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  • H01T 13/41 with interference suppressing or shielding means
  • H01T 13/42 with magnetic spark generators
  • H01T 13/44 with transformers, e.g. for high-frequency ignition

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634