Forming devices by joining two substrates together, e.g. lamination techniques

Full Title

Manufacture or treatment specially adapted for the organic devices covered by this subclass > Forming devices by joining two substrates together, e.g. lamination techniques

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

ORGANIC ELECTRIC SOLID-STATE DEVICES