CPC Main Group
B23B 37/00 Boring by making use of vibrations of ultrasonic frequency (working materials by subjecting the grinding tools or the abrading medium to vibration, e.g. grinding with ultrasonic frequency, B24B1/04)
Top Applicants
Top 10 applicants by patent filingsfor class B23, 2013–2023, worldwide · Source: EPO PATSTAT
- ITW (ILLINOIS TOOL WORKS) US 3,642
- DISCO CORPORATION JP 3,316
- FANUC JP 3,111
- ROBERT BOSCH DE 2,711
- FANUC 2,163
- GE (GENERAL ELECTRIC COMPANY) US 2,113
- ISCAR IL 1,516
- SIEMENS DE 1,459
- LINCOLN GLOBAL US 1,433
- KOBE STEEL JP 1,423