B23B 37/00 Boring by making use of vibrations of ultrasonic frequency (working materials by subjecting the grinding tools or the abrading medium to vibration, e.g. grinding with ultrasonic frequency, B24B1/04)
Introduced: September 1968
Title
Titles differ between systems:
IPC: Boring by making use of vibrations of ultrasonic frequency
CPC: Boring by making use of vibrations of ultrasonic frequency (working materials by subjecting the grinding tools or the abrading medium to vibration, e.g. grinding with ultrasonic frequency, B24B1/04)
Full Title
Full titles differ between systems:
Boring by making use of vibrations of ultrasonic frequency
Boring by making use of vibrations of ultrasonic frequency (working materials by subjecting the grinding tools or the abrading medium to vibration, e.g. grinding with ultrasonic frequency, B24B1/04)
No child classifications to compare. This is a leaf node in both IPC and CPC.
Top Applicants
Top Applicants (IPC)
Class B23,2013–2023, worldwide · Source: EPO PATSTAT
- ITW (ILLINOIS TOOL WORKS) US 3,407
- FANUC JP 3,120
- DISCO ABRASIVE SYSTEM 2,777
- HAN'S LASER TECHNOLOGY INDUSTRY GROUP COMPANY 2,629
- ROBERT BOSCH DE 2,468
- FANUC 2,273
- DISCO CORPORATION JP 2,267
- GE (GENERAL ELECTRIC COMPANY) US 1,611
- CHINESE ACADEMY OF SCIENCES 1,534
- ISCAR IL 1,499
Top Applicants (CPC)
Class B23,2013–2023, worldwide · Source: EPO PATSTAT
- ITW (ILLINOIS TOOL WORKS) US 3,642
- DISCO CORPORATION JP 3,316
- FANUC JP 3,111
- ROBERT BOSCH DE 2,711
- FANUC 2,163
- GE (GENERAL ELECTRIC COMPANY) US 2,113
- ISCAR IL 1,516
- SIEMENS DE 1,459
- LINCOLN GLOBAL US 1,433
- KOBE STEEL JP 1,423