CPC Subgroup
B23K 1/08 Soldering by means of dipping in molten solder
Full Title
Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence) > Soldering by means of dipping in molten solder
1 direct subcode
Child Classifications
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Top Applicants
Top 10 applicants by patent filingsfor class B23, 2013–2023, worldwide · Source: EPO PATSTAT
- ITW (ILLINOIS TOOL WORKS) US 3,642
- DISCO CORPORATION JP 3,316
- FANUC JP 3,111
- ROBERT BOSCH DE 2,711
- FANUC 2,163
- GE (GENERAL ELECTRIC COMPANY) US 2,113
- ISCAR IL 1,516
- SIEMENS DE 1,459
- LINCOLN GLOBAL US 1,433
- KOBE STEEL JP 1,423