CPC Main Group
B23K 1/00 Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence)
14 direct subcodes
Child Classifications
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- B23K 1/002 Soldering by means of induction heating
- B23K 1/005 Soldering by means of radiant energy
- B23K 1/008 Soldering within a furnace (B23K1/012 takes precedence)
- B23K 1/012 Soldering with the use of hot gas
- B23K 1/018 Unsoldering; Removal of melted solder or other residues
- B23K 1/06 making use of vibrations, e.g. supersonic vibrations
- B23K 1/08 Soldering by means of dipping in molten solder
- B23K 1/14 specially adapted for soldering seams
- B23K 1/19 taking account of the properties of the materials to be soldered
- B23K 1/20 Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
Top Applicants
Top 10 applicants by patent filingsfor class B23, 2013–2023, worldwide · Source: EPO PATSTAT
- ITW (ILLINOIS TOOL WORKS) US 3,642
- DISCO CORPORATION JP 3,316
- FANUC JP 3,111
- ROBERT BOSCH DE 2,711
- FANUC 2,163
- GE (GENERAL ELECTRIC COMPANY) US 2,113
- ISCAR IL 1,516
- SIEMENS DE 1,459
- LINCOLN GLOBAL US 1,433
- KOBE STEEL JP 1,423