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CPC Subgroup
B23K 26/53

for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

Full Title

Working by laser beam, e.g. welding, cutting or boring > Working by transmitting the laser beam through or within the workpiece > for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

Top Applicants

Top 10 applicants by patent filingsfor class B23, 2013–2023, worldwide · Source: EPO PATSTAT

  1. ITW (ILLINOIS TOOL WORKS) US 3,642
  2. DISCO CORPORATION JP 3,316
  3. FANUC JP 3,111
  4. ROBERT BOSCH DE 2,711
  5. FANUC 2,163
  6. GE (GENERAL ELECTRIC COMPANY) US 2,113
  7. ISCAR IL 1,516
  8. SIEMENS DE 1,459
  9. LINCOLN GLOBAL US 1,433
  10. KOBE STEEL JP 1,423