CPC Main Group
B26F 1/00 Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor (perforating by laser beam B23K26/00; subjecting the grinding tools or the abrading medium to vibration, e.g. grinding with ultrasonic frequency, B24B1/04; perforating by sand-blasting B24C; punching cards or tapes for statistical and record purposes G06K1/00)
11 direct subcodes
Child Classifications
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- B26F 1/02 Perforating by punching, e.g. with relatively-reciprocating punch and bed
- B26F 1/16 Perforating by tool or tools of the drill type
- B26F 1/18 Perforating by slitting, i.e. forming cuts closed at their ends without removal of material
- B26F 1/24 Perforating by needles or pins
- B26F 1/26 Perforating by non-mechanical means, e.g. by fluid jet
- B26F 1/32 Hand-held perforating or punching apparatus, e.g. awls
- B26F 1/38 Cutting-out; Stamping-out
Top Applicants
Top 10 applicants by patent filingsfor class B26, 2013–2023, worldwide · Source: EPO PATSTAT
- GILLETTE COMPANY US 1,745
- PHILIPS ELECTRONICS NL 1,410
- BIC-VIOLEX GR 638
- PHILIPS ELECTRONICS 378
- DISCO CORPORATION JP 355
- BRAUN DE 325
- WEBER MASCHINENBAUBREIDENBACH DE 304
- DORCO COMPANY KR 297
- GILLETTE COMPANY 290
- URSCHEL LABORATORIES US 264