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CPC Subgroup
B26F 1/18

Perforating by slitting, i.e. forming cuts closed at their ends without removal of material

Full Title

Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor (perforating by laser beam B23K26/00; subjecting the grinding tools or the abrading medium to vibration, e.g. grinding with ultrasonic frequency, B24B1/04; perforating by sand-blasting B24C; punching cards or tapes for statistical and record purposes G06K1/00) > Perforating by slitting, i.e. forming cuts closed at their ends without removal of material

Filing statistics

CPC B26F 1/18 belongs to the parent subclass B26F, which recorded 24,189 patent applications worldwide between 2013 and 2023. Annual filings grew from 1,194 in 2013 to 1,957 in 2023 (+64%), peaking at 3,233 applications in 2020. The most active applicants in class B26 are GILLETTE COMPANY (1,745 applications), PHILIPS ELECTRONICS (1,410 applications) and BIC-VIOLEX (638 applications).

Source: EPO PATSTAT, worldwide filings

2 direct subcodes

Child Classifications

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  • B26F 1/20 with tools carried by a rotating drum or similar support (B26F1/22 takes precedence)
  • B26F 1/22 to form non-rectilinear cuts, e.g. for tabs

Top Applicants

Top 10 applicants by patent filingsfor class B26, 2013–2023, worldwide · Source: EPO PATSTAT

  1. GILLETTE COMPANY US 1,745
  2. PHILIPS ELECTRONICS NL 1,410
  3. BIC-VIOLEX GR 638
  4. PHILIPS ELECTRONICS 378
  5. DISCO CORPORATION JP 355
  6. BRAUN DE 325
  7. WEBER MASCHINENBAUBREIDENBACH DE 304
  8. DORCO COMPANY KR 297
  9. GILLETTE COMPANY 290
  10. URSCHEL LABORATORIES US 264