CPC Subgroup
B29C 61/04 Thermal expansion
Full Title
Shaping by liberation of internal stresses; Making preforms having internal stresses; Apparatus therefor (for surface shaping B29C59/18; for lining articles B29C63/38; for joining preformed parts B29C65/66 ) > Thermal expansion
Top Applicants
Top 10 applicants by patent filingsfor class B29, 2013–2023, worldwide · Source: EPO PATSTAT
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 4,167
- BOEING COMPANY US 3,701
- COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN FR 2,554
- 3M INNOVATIVE PROPERTIES COMPANY (MINNESOTA MINING AND MANUFACTURING INNOVATIVE PROPERTIES COMPANY) US 2,240
- TORAY INDUSTRIES JP 2,133
- GE (GENERAL ELECTRIC COMPANY) US 2,069
- BASF (BADISCHE ANILIN & SODA FABRIK) DE 2,028
- LG CHEM KR 1,962
- DOW GLOBAL TECHNOLOGIES US 1,896
- CONTINENTAL REIFEN DE 1,725